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The new material could allow reliable thermal interfaces as thin as three microns — compared to as much as 50 to 75 microns with conventional materials. Rather than pursue materials because of their high thermal conductivity, Cola and his collaborators investigated materials that could provide higher levels of contact in the interface. Along with dramatic advances in satellite technology over the past decade, ground equipment has similarly evolved, benefiting from higher levels of integration and increasing processing power, expanding both capacity and performance boundaries. Sony has established itself as a brand known for pushing the boundaries of technology. Baratunde Cola, an assistant professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. The project involved researchers from the Georgia Institute of Technology, University of Texas at Austin, and the Raytheon Company. For more information on the data displayed, use the info button right next to the boxes.